Mijing Z21 Max BGA Stencil Magnetic Platform For Android CPU ( Hisilicon / Qualcomm, MTK ) Upgraded

$ 1.46

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Features: Automatic precise positioning The new magnetic dynamic original positioning Strong magnetic force automatic clamping Installation Method: Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh) Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip) Package includes: 1 x Tin planting platform set
Mijing Z21 Max BGA Stencil Magnetic Platform For Android CPU ( Hisilicon / Qualcomm, MTK ) Upgraded
Buy on Amazon
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